Electrical Components White Papers

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Cutting Edge Multicore Development Techniques for the Next Wave of Electronics Products
sponsored by IBM
WHITE PAPER: As more and more software is embedded into both consumer and industrial electronics, the electronics industry is being challenged with ensuring rigor within its software development process, often a new core competency, and the integration of hardware and software. Read this paper to learn about solutions that address these complex challenges.
Posted: 01 Sep 2010 | Published: 19 Mar 2010

IBM

Prepare, predict, pinpoint: HP Operations Analytics
sponsored by Hewlett Packard Enterprise
WHITE PAPER: In this white paper, discover the best way to manage all of this data: by exploiting big data management and analytics. Read on now to learn about one standalone solution that offers the means to collect and analyze huge data volumes from multiple perspectives, and provides tremendous opportunities to IT operations.
Posted: 21 Feb 2014 | Published: 31 Dec 2013

Hewlett Packard Enterprise

5 Reasons Environmental Sensors are used in all Modern Data Centers
sponsored by Raritan Inc.
WHITE PAPER: This whitepaper offers five reasons you should consider implementing environmental sensors in your data center.
Posted: 25 Mar 2014 | Published: 25 Mar 2014

Raritan Inc.

FIFO Solutions for Increasing Clock Rates and Data Widths
sponsored by Texas Instruments, Inc.
WHITE PAPER: Steady increases in microprocessor operating frequencies and bus widths over recent years have challenged system designers to find FIFO memories that meet their needs.
Posted: 13 Apr 2000 | Published: 01 Jan 1996

Texas Instruments, Inc.

Built-in Self-test (BIST) Using Boundary Scan
sponsored by Texas Instruments, Inc.
WHITE PAPER: This document shows how existing architectures can be modified to conform to IEEE 1149.1 architecture.
Posted: 09 May 2000 | Published: 01 Dec 1996

Texas Instruments, Inc.

Dynamic Infrastructures for VMware vCloud
sponsored by Fujitsu
WHITE PAPER: Check out this exclusive white paper to discover how a VMware-based infrastructure solution can accelerate cloud infrastructure implementation, while reducing maintenance costs and effort.
Posted: 05 Mar 2014 | Published: 31 Dec 2012

Fujitsu

HP's latest management solution will help conquer data center challenges
sponsored by HPE and Intel®
WHITE PAPER: Take a look at this exclusive resource to find out how HP's new approach to infrastructure management can help you save time and money when confronting data center challenges.
Posted: 05 Feb 2014 | Published: 31 Oct 2013

HPE and Intel®

Reduce data center complexity when you 'go virtual'
sponsored by HPE and Intel®
WHITE PAPER: Access this exclusive, in-depth resource to find out how HP's latest solution for virtual environments can benefit your organization.
Posted: 04 Mar 2014 | Published: 31 Dec 2013

HPE and Intel®

WebSphere DataPower Integration Blade XI50B
sponsored by IBM
WHITE PAPER: Read this paper to learn about WebSphere DataPower Integration Blade XI50B, a specialized, high-performance hardware appliance that can empower you t improve competitiveness by helping to strengthen business connectivity with partners and customers, and between internal organizations, add specialized connectivity, integration and more.
Posted: 12 Apr 2012 | Published: 12 Apr 2012

IBM

Wyse Intel-Based 3000 Series Thin Client: Powerful, Highly Configurable
sponsored by Dell
WHITE PAPER: Get a quick look at the Wyse Intel-based 3000 series thin client, a solution capable of driving a range of applications.
Posted: 13 Nov 2014 | Published: 11 Nov 2014

Dell